هفته نامه اطلاع رسانی اختراعات منتشر شده در سازمان جهانی مالکیت فکری
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سال	هفته	ID	Title	ApplNo	IPC	Applicant	Subgroup	زیر گروه	رشته	شرح	Description
2026	02	WO/2024/182939	LIGHT-EMITTING SUBSTRATE, BACKLIGHT MODULE AND DISPLAY APPARATUS	CN2023/079652	H01L 25/16	BOE TECHNOLOGY GROUP CO., LTD.	ELECTRICITY	الکتریسیته	دانش هسته ای
2026	02	WO/2026/007112	SUBSTRATE FOR MOUNTING ELECTRONIC COMPONENT, ELECTRONIC MODULE, AND BASE STATION	CN2024/103936	H01L 23/498	TELEFONAKTIEBOLAGET LM ERICSSON (PUBL)	ELECTRICITY	الکتریسیته	دانش هسته ای
2026	02	WO/2026/007169	PUMPING RING AND SEMICONDUCTOR PROCESSING DEVICE	CN2024/105689	H01L 21/67	PIOTECH (SHENYANG) SEMICONDUCTOR EQUIPMENT CO., LTD.	ELECTRICITY	الکتریسیته	دانش هسته ای
2026	02	WO/2026/007450	POWER MODULE AND POWER DEVICE	CN2025/081695	H01L 23/495	HUAWEI DIGITAL POWER TECHNOLOGIES CO., LTD.	ELECTRICITY	الکتریسیته	دانش هسته ای
2026	02	WO/2026/007537	OPTOELECTRONIC INTERCONNECTION PACKAGING STRUCTURE AND PREPARATION METHOD THEREFOR	CN2025/093617	H01L 21/50	SJ SEMICONDUCTOR (JIANGYIN) CORPORATION	ELECTRICITY	الکتریسیته	دانش هسته ای
2026	02	WO/2026/007538	OPTOELECTRONIC INTERCONNECTION PACKAGING STRUCTURE AND PREPARATION METHOD THEREFOR	CN2025/093618	H01L 21/50	SJ SEMICONDUCTOR (JIANGYIN) CORPORATION	ELECTRICITY	الکتریسیته	دانش هسته ای
2026	02	WO/2026/007539	OPTOELECTRONIC INTERCONNECTION PACKAGING STRUCTURE AND PREPARATION METHOD THEREFOR	CN2025/093619	H01L 21/50	SJ SEMICONDUCTOR (JIANGYIN) CORPORATION	ELECTRICITY	الکتریسیته	دانش هسته ای
2026	02	WO/2026/007558	EMBEDDED PACKAGING STRUCTURE AND PACKAGING METHOD	CN2025/095755	H01L 25/16	SHANGHAI FINE CHIP SEMICONDUCTOR CO., LTD.	ELECTRICITY	الکتریسیته	دانش هسته ای
2026	02	WO/2026/007744	CARRYING APPARATUS, WAFER TRANSFER APPARATUS, AND SEMICONDUCTOR PROCESSING DEVICE	CN2025/103003	H01L 21/687	BEIJING NAURA MICROELECTRONICS EQUIPMENT CO., LTD.	ELECTRICITY	الکتریسیته	دانش هسته ای
2026	02	WO/2026/007746	POWER UNIT, THREE-PHASE FULL-BRIDGE POWER MODULE, POWER SUPPLY SYSTEM, AND VEHICLE	CN2025/103034	H01L 25/07	BYD COMPANY LIMITED	ELECTRICITY	الکتریسیته	دانش هسته ای
2026	02	WO/2026/008207	INDUCTOR STRUCTURES IN HYBRID BONDED DEVICES	EP2025/064066	H01L 23/00	INTERNATIONAL BUSINESS MACHINES CORPORATION	ELECTRICITY	الکتریسیته	دانش هسته ای
2026	02	WO/2026/008571	CHUCK SYSTEM, METHOD AND USE FOR HOLDING A SEMICONDUCTOR WAFER ON A CHUCK	EP2025/068563	H01L 21/67	ATT ADVANCED TEMPERATURE TEST SYSTEMS GMBH	ELECTRICITY	الکتریسیته	دانش هسته ای
2026	02	WO/2026/008677	COOLED MANIPULATOR FOR ULTRAHIGH VACUUM-COMPATIBLE PROCESS DEVICE, ULTRAHIGH-VACUUM-COMPATIBLE PROCESS DEVICE, AND ULTRAHIGH VACUUM DEPOSITION METHOD	EP2025/068779	H01L 21/67	RIBER	ELECTRICITY	الکتریسیته	دانش هسته ای
2026	02	WO/2026/009269	HETERO-JUNCTION BIPOLAR TRANSISTOR	JP2024/023749	H01L 29/737	NTT, INC.	ELECTRICITY	الکتریسیته	دانش هسته ای
2026	02	WO/2026/009270	ACTIVE MATRIX SUBSTRATE, AND DISPLAY DEVICE AND X-RAY SENSOR DEVICE COMPRISING SAME	JP2024/023751	H01L 29/786	SHARP DISPLAY TECHNOLOGY CORPORATION	ELECTRICITY	الکتریسیته	دانش هسته ای
2026	02	WO/2026/009272	SEARCH DEVICE, DATA COMPRESSION PROCESSING DEVICE, SEMICONDUCTOR DEVICE MANUFACTURING SYSTEM, SEARCH METHOD, AND DATA COMPRESSION PROCESSING METHOD	JP2024/023760	H01L 21/3065	HITACHI HIGH-TECH CORPORATION	ELECTRICITY	الکتریسیته	دانش هسته ای
2026	02	WO/2026/009295	SEMICONDUCTOR DEVICE MANUFACTURING SYSTEM, SERVER, AND FOREIGN OBJECT GENERATION FACTOR SPECIFYING METHOD	JP2024/023816	H01L 21/02	HITACHI HIGH-TECH CORPORATION	ELECTRICITY	الکتریسیته	دانش هسته ای
2026	02	WO/2026/009326	SEMICONDUCTOR DEVICE AND POWER CONVERSION DEVICE	JP2024/023967	H01L 25/07	MITSUBISHI ELECTRIC CORPORATION	ELECTRICITY	الکتریسیته	دانش هسته ای
2026	02	WO/2026/009340	POWER CONVERTER	JP2024/024027	H01L 23/12	MITSUBISHI ELECTRIC CORPORATION	ELECTRICITY	الکتریسیته	دانش هسته ای
2026	02	WO/2026/009353	SUBSTRATE PROCESSING METHOD, METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE, PROGRAM, AND SUBSTRATE PROCESSING DEVICE	JP2024/024131	H01L 21/3065	KOKUSAI ELECTRIC CORPORATION	ELECTRICITY	الکتریسیته	دانش هسته ای
2026	02	WO/2026/009358	SEMICONDUCTOR DEVICE AND METHOD FOR PRODUCING SEMICONDUCTOR DEVICE	JP2024/024152	H01L 23/12	ASTEMO, LTD.	ELECTRICITY	الکتریسیته	دانش هسته ای
2026	02	WO/2026/009374	METHOD FOR DETECTING MICROCRACK	JP2024/024272	H01L 21/66	YAMAHA ROBOTICS HOLDINGS CO., LTD.	ELECTRICITY	الکتریسیته	دانش هسته ای
2026	02	WO/2026/009416	POWER CONVERSION DEVICE	JP2024/024415	H01L 23/40	MITSUBISHI ELECTRIC CORPORATION	ELECTRICITY	الکتریسیته	دانش هسته ای
2026	02	WO/2026/009425	SUBSTRATE STORAGE CONTAINER AND FILTER UNIT	JP2024/024453	H01L 21/673	MIRAIAL CO., LTD.	ELECTRICITY	الکتریسیته	دانش هسته ای
2026	02	WO/2026/009428	SUBSTRATE STORAGE CONTAINER AND GAS JETTING NOZZLE PART	JP2024/024463	H01L 21/673	MIRAIAL CO., LTD.	ELECTRICITY	الکتریسیته	دانش هسته ای
2026	02	WO/2026/009461	SEMICONDUCTOR DEVICE AND POWER CONVERSION DEVICE	JP2024/037320	H01L 23/52	MITSUBISHI ELECTRIC CORPORATION	ELECTRICITY	الکتریسیته	دانش هسته ای
2026	02	WO/2026/009462	LEAD FRAME, SEMICONDUCTOR DEVICE, AND POWER CONVERSION DEVICE	JP2024/037321	H01L 23/52	MITSUBISHI ELECTRIC CORPORATION	ELECTRICITY	الکتریسیته	دانش هسته ای
2026	02	WO/2026/009548	CIRCUIT MODULE AND SOLDERED CIRCUIT MODULE	JP2025/015953	H01L 23/28	MURATA MANUFACTURING CO., LTD.	ELECTRICITY	الکتریسیته	دانش هسته ای
2026	02	WO/2026/009550	ADHESIVE SHEET, PRECURSOR OF SEMICONDUCTOR DEVICE INCLUDING ADHESIVE SHEET, SEMICONDUCTOR DEVICE PRODUCED USING ADHESIVE SHEET, AND METHOD FOR PRODUCING SEMICONDUCTOR DEVICE USING ADHESIVE SHEET	JP2025/016206	H01L 23/50	TOMOEGAWA CORPORATION	ELECTRICITY	الکتریسیته	دانش هسته ای
2026	02	WO/2026/009554	SUBSTRATE BONDING DEVICE	JP2025/016585	H01L 21/02	SCREEN HOLDINGS CO., LTD.	ELECTRICITY	الکتریسیته	دانش هسته ای
2026	02	WO/2026/009583	MEMBER FOR SEMICONDUCTOR MANUFACTURING APPARATUS	JP2025/017842	H01L 21/683	NGK INSULATORS, LTD.	ELECTRICITY	الکتریسیته	دانش هسته ای
2026	02	WO/2026/009595	FOREIGN MATTER REMOVAL DEVICE AND FOREIGN MATTER REMOVAL METHOD	JP2025/018591	H01L 21/304	TOKYO ELECTRON LIMITED	ELECTRICITY	الکتریسیته	دانش هسته ای
2026	02	WO/2026/009597	MEMBER FOR SEMICONDUCTOR MANUFACTURING APPARATUS	JP2025/018720	H01L 21/683	NGK INSULATORS, LTD.	ELECTRICITY	الکتریسیته	دانش هسته ای
2026	02	WO/2026/009641	VAPOR-PHASE GROWING APPARATUS AND VAPOR-PHASE GROWING METHOD	JP2025/020647	H01L 21/205	TAIYO NIPPON SANSO CORPORATION	ELECTRICITY	الکتریسیته	دانش هسته ای
2026	02	WO/2026/009667	ELECTRIC POWER CONVERTING DEVICE	JP2025/021280	H01L 23/40	HITACHI, LTD.	ELECTRICITY	الکتریسیته	دانش هسته ای
2026	02	WO/2026/009678	ELECTROSTATIC CHUCK DEVICE, METHOD FOR MANUFACTURING ELECTROSTATIC CHUCK DEVICE, AND METHOD FOR MANUFACTURING STACK	JP2025/021463	H01L 21/683	SUMITOMO OSAKA CEMENT CO., LTD.	ELECTRICITY	الکتریسیته	دانش هسته ای
2026	02	WO/2026/009713	SUBSTRATE SUPPORT DEVICE, SUBSTRATE PROCESSING APPARATUS, AND BASE	JP2025/022020	H01L 21/683	TOKYO ELECTRON LIMITED	ELECTRICITY	الکتریسیته	دانش هسته ای
2026	02	WO/2026/009716	SUBSTRATE PROCESSING DEVICE AND SUBSTRATE PROCESSING METHOD	JP2025/022048	H01L 21/3065	TOKYO ELECTRON LIMITED	ELECTRICITY	الکتریسیته	دانش هسته ای
2026	02	WO/2026/009751	LIQUID TREATMENT DEVICE, LIQUID TREATMENT METHOD, AND LIQUID FLOW REGULATION MEMBER	JP2025/022553	H01L 21/306	TOKYO ELECTRON LIMITED	ELECTRICITY	الکتریسیته	دانش هسته ای
2026	02	WO/2026/009769	FILM FORMING METHOD, FILM FORMING APPARATUS, AND SEMICONDUCTOR DEVICE	JP2025/022673	H01L 21/365	TOKYO ELECTRON LIMITED	ELECTRICITY	الکتریسیته	دانش هسته ای
2026	02	WO/2026/009773	COMPONENT ASSEMBLY USED IN SEMICONDUCTOR MANUFACTURING DEVICE, ELECTRODE PLATE USED IN SUBSTRATE PROCESSING DEVICE, POSITIONING METHOD, AND SEMICONDUCTOR MANUFACTURING DEVICE	JP2025/022735	H01L 21/3065	TOKYO ELECTRON LIMITED	ELECTRICITY	الکتریسیته	دانش هسته ای
2026	02	WO/2026/009813	WAFER MOUNTING STAND	JP2025/023090	H01L 21/683	NGK INSULATORS, LTD.	ELECTRICITY	الکتریسیته	دانش هسته ای
2026	02	WO/2026/009814	WAFER MOUNTING STAND	JP2025/023091	H01L 21/683	NGK INSULATORS, LTD.	ELECTRICITY	الکتریسیته	دانش هسته ای
2026	02	WO/2026/009830	RELEASE AGENT COMPOSITION, LAMINATE, AND PRODUCTION METHOD FOR PROCESSED SEMICONDUCTOR SUBSTRATE	JP2025/023205	H01L 21/02	NISSAN CHEMICAL CORPORATION	ELECTRICITY	الکتریسیته	دانش هسته ای
2026	02	WO/2026/009872	MOUNTING DEVICE, MOUNTING METHOD, AND MOUNTING CONTROL PROGRAM	JP2025/023537	H01L 21/60	YAMAHA ROBOTICS HOLDINGS CO., LTD.	ELECTRICITY	الکتریسیته	دانش هسته ای
2026	02	WO/2026/009887	WIRING BOARD AND ELECTRONIC MODULE	JP2025/023612	H01L 23/12	KYOCERA CORPORATION	ELECTRICITY	الکتریسیته	دانش هسته ای
2026	02	WO/2026/009977	SUBSTRATE FOR SEMICONDUCTOR DEVICE, METHOD FOR MANUFACTURING SAME, AND SEMICONDUCTOR DEVICE	JP2025/024229	H01L 23/50	MITSUI HIGH-TEC, INC.	ELECTRICITY	الکتریسیته	دانش هسته ای
2026	02	WO/2026/009999	METHOD FOR MANUFACTURING DISPLAY DEVICE USING LIGHT-EMITTING ELEMENT AND DEVICE FOR MANUFACTURING SAME	KR2024/009218	H01L 23/00	LG ELECTRONICS INC.	ELECTRICITY	الکتریسیته	دانش هسته ای
2026	02	WO/2026/010196	SUBSTRATE BONDING APPARATUS	KR2025/008166	H01L 21/67	ZEUS CO., LTD.	ELECTRICITY	الکتریسیته	دانش هسته ای
2026	02	WO/2026/010282	SEMICONDUCTOR PACKAGE BONDING METHOD AND SEMICONDUCTOR PACKAGE BONDING APPARATUS USED THEREFOR	KR2025/009209	H01L 23/00	IUCF-HYU(INDUSTRY-UNIVERSITY COOPERATION FOUNDATION HANYANG UNIVERSITY)	ELECTRICITY	الکتریسیته	دانش هسته ای
2026	02	WO/2026/010361	ELECTRONIC DEVICE AND ELECTRONIC DEVICE CONTROL METHOD	KR2025/009431	H01L 21/02	JUSUNG ENGINEERING CO., LTD.	ELECTRICITY	الکتریسیته	دانش هسته ای
2026	02	WO/2026/010367	SIONC THIN FILM AND METHOD FOR MANUFACTURING SAME	KR2025/009443	H01L 21/02	IUCF-HYU(INDUSTRY-UNIVERSITY COOPERATION FOUNDATION HANYANG UNIVERSITY)	ELECTRICITY	الکتریسیته	دانش هسته ای
2026	02	WO/2026/010555	GRAPHENE-BASED THERMAL INTERFACE PAD HAVING A CURVED SURFACE AND METHOD FOR MANUFACTURING THE PAD	SE2025/050649	H01L 23/373	SHT SMART HIGH-TECH AB	ELECTRICITY	الکتریسیته	دانش هسته ای
2026	02	WO/2026/010654	INTEGRATED DEVICES AND METHOD FOR MANUFACTURING SAME	US2025/017238	H01L 21/02	MICROCHIP TECHNOLOGY INCORPORATED	ELECTRICITY	الکتریسیته	دانش هسته ای
2026	02	WO/2026/010661	ENHANCED BACK VIA LANDING METAL LAYER ADHESION	US2025/022777	H01L 21/768	MACOM TECHNOLOGY SOLUTIONS HOLDINGS, INC.	ELECTRICITY	الکتریسیته	دانش هسته ای
2026	02	WO/2026/010662	SELECTIVE DEPOSITION ON AN EXISTING PATTERNED MASK	US2025/022805	H01L 21/033	TOKYO ELECTRON LIMITED	ELECTRICITY	الکتریسیته	دانش هسته ای
2026	02	WO/2026/010664	METHOD FOR SEMICONDUCTOR PROCESSING	US2025/024601	H01L 21/285	TOKYO ELECTRON LIMITED	ELECTRICITY	الکتریسیته	دانش هسته ای
2026	02	WO/2026/010689	SUBSTRATE FOR SEMICONDUCTOR FABRICATION HAVING SELECTIVELY TREATED PERIMETER AND METHOD OF TREATING	US2025/031167	H01L 23/15	APPLIED MATERIALS, INC.	ELECTRICITY	الکتریسیته	دانش هسته ای
2026	02	WO/2026/010690	SELECTIVE MATERIAL DEPOSITION	US2025/031508	H01L 21/768	APPLIED MATERIALS, INC.	ELECTRICITY	الکتریسیته	دانش هسته ای
2026	02	WO/2026/010709	INTERCONNECT SUBSTRATE AND METHOD OF MAKING	US2025/033102	H01L 23/538	DECA TECHNOLOGIES USA, INC.	ELECTRICITY	الکتریسیته	دانش هسته ای
2026	02	WO/2026/010718	MODULARIZED CONSTRUCT FOR COMPLEX MULTI-DIE INTEGRATION PACKAGE	US2025/033362	H01L 25/065	ADVANCED MICRO DEVICES, INC.	ELECTRICITY	الکتریسیته	دانش هسته ای
2026	02	WO/2026/010728	THREE-DIMENSIONAL CLEAVAGE TECHNIQUES USING STEALTH DICING, AND ASSOCIATED SYSTEMS AND METHODS	US2025/033849	H01L 21/78	MICRON TECHNOLOGY, INC.	ELECTRICITY	الکتریسیته	دانش هسته ای
2026	02	WO/2026/010759	SELECTIVE ETCHING OF SILICON NITRIDE DIELECTRICS WITH MICROWAVE OXIDATION	US2025/034903	H01L 21/311	APPLIED MATERIALS, INC.	ELECTRICITY	الکتریسیته	دانش هسته ای
2026	02	WO/2026/010781	DOPED DIELECTRIC PACKAGING FILM	US2025/035233	H01L 21/56	LAM RESEARCH CORPORATION	ELECTRICITY	الکتریسیته	دانش هسته ای
2026	02	WO/2026/010782	CARRIER RING DESIGNS	US2025/035242	H01L 21/687	LAM RESEARCH CORPORATION	ELECTRICITY	الکتریسیته	دانش هسته ای
2026	02	WO/2026/010805	HYBRID BONDING OF SEMICONDUCTOR CMOS WAFER AND SEMICONDUCTOR MEMORY ARRAY WAFER USING DEBONDABLE CARRIERS	US2025/035556	H01L 23/00	MICRON TECHNOLOGY, INC.	ELECTRICITY	الکتریسیته	دانش هسته ای
2026	02	WO/2026/010811	REDUCED UNDERLAYER OXIDATION DURING GAP FILL	US2025/035586	H01L 21/762	APPLIED MATERIALS, INC.	ELECTRICITY	الکتریسیته	دانش هسته ای
2026	02	WO/2026/010815	METHODS OF DEPOSITING SILICON-CONTAINING FILMS FOR SEMICONDUCTOR DEVICES	US2025/035618	H01L 21/02	APPLIED MATERIALS, INC.	ELECTRICITY	الکتریسیته	دانش هسته ای
2026	02	WO/2026/010834	SUBSTRATE SUPPORT ASSEMBLY HAVING AN INTEGRATED SPRING PRESSURE PLATE	US2025/035789	H01L 21/687	APPLIED MATERIALS, INC.	ELECTRICITY	الکتریسیته	دانش هسته ای
2026	02	WO/2026/010856	DUMMY COMPONENTS IN INTEGRATED CIRCUITS	US2025/035892	H01L 21/762	TEXAS INSTRUMENTS INCORPORATED	ELECTRICITY	الکتریسیته	دانش هسته ای
2026	02	WO/2026/010891	HYBRID RESISTOR WITH ORIENTED HYBRID INSULATION LAYERS	US2025/035977	H01L 21/02	ATLAS MAGNETICS	ELECTRICITY	الکتریسیته	دانش هسته ای
2026	02	WO/2026/010988	BUILD UP BONDING LAYER PROCESS AND STRUCTURE FOR LOW TEMPERATURE COPPER BONDING	US2025/036134	H01L 23/528	ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC.	ELECTRICITY	الکتریسیته	دانش هسته ای
2026	02	WO/2026/011058	REDUNDANT BOND PADS IN STACKED SEMICONDUCTOR ARCHITECTURES	US2025/036263	H01L 23/522	MICRON TECHNOLOGY, INC.	ELECTRICITY	الکتریسیته	دانش هسته ای
2026	02	WO/2026/011161	SUBSTRATE CONTAINER ADAPTER	US2025/036519	H01L 21/673	ENTEGRIS, INC.	ELECTRICITY	الکتریسیته	دانش هسته ای